Content
DVD 1
Lecture 1
"Introduction to Failure Analysis"
Presenter: Rich Anderson
Sandia Labs
In Lecture 1, Rich presents an introduction to Failure Analysis and also highlights the topics to be covered in the course. This lecture is a good overview of the FA process.
- Introduce the general concept of FA
- Describe the role of FA in the IC industry
- Show examples of the FA process
- Microelectronics challenges for FA
- Describe the content of this course
- Provide resources for more information
Included with this lecture, you will receive 40 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 2
"Basic Failure Analysis Techniques I"
Presenter: Chris Henderson
Semitracks Inc.
In lecture 2 Chrisbegins laying out the process of FA. As his explanation unfolds he introduces many terms and concepts that will be built upon later in the course. Chris is very good at presenting complex topics in clear and simple terms, yet he manages to include many details in the process.
Some of the issues covered are: Fault Isolation, Deprocessing, Inspection (PEM, liquid crystal, wet etch, dry etch, optical, SEM, microprobing, and FIB).
Topics:
- Motivation for FA
- Basic Philosophical Principles
- Practical Principles
- Process Flow Diagrams
Included with lectures 2 and 3, you will receive 95 presentation slides in PDF format. Lecture time is approximately 75 minutes per lecture.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 3
"Basic Failure Analysis Techniques II"
Presenter: Chris Henderson
Semitracks Inc.
Lecture 3 continues with the topics listed below.
Topics:
- Fault Localization / Fault Isolation
- Microlocalization Techniques
- Analytical Characterization
- Fault/Defect Isolation Techniques
- FA Tools:Electron Beam, Ion Beam, Thermal Detection
- Infrared Imaging
- Light Emission Microscopy
- “Hot Spot” Analysis
- Charge-Induced Voltage Alteration
- CIVA Imaging
- And Lots More...
Included with lectures 2 and 3, you will receive 95 presentation slides in PDF format. Lecture time is approximately 75 minutes per lecture.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 2
Lecture 4
"Electron Microscopy"
Presenter: Larry Wagner
Texas Instruments
Lecture 4 addresses various methods and techniques of Microscopy. Then discusses the associated trade-offs. See the topics below.
Topics:
- Three Phases of Microscopy and Analysis
- SEM/Optical Comparisons
- X-ray Detection Techniques
- Trade-offs in Microscopy
- Scanning Microscopy
- Optical Microscopy
- Polarized Imaging
- Light Microscopy for Liquid Crystal
- Fluorescence Microscopy
- IR (Infrared) Microscopy
- Confocal Microscopy
- UV Microscope
- SEM Radiation Sources
- Astigmatism
- And much more
Included with this lecture, you will receive 80 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 5
Fault Isolation Scanning Optical Microscopy
Presenter: Ed Cole
Sandia Labs
In Lecture 5 Ed explains Advanced Fault Isolation using a variety of tools and techniques.
Topics:
- Low Energy CIVA (LECIVA)
- Confocal and OBIC Imaging
- New SOM techniques
- Light-Induced Voltage Alteration (LIVA)
- Thermally Induced Voltage Alteration (TIVA)
- Seebeck Effect Imaging (SEI)
- Surface Charging Phenomenon
- Capacitive Charge Generation (CCG)
- Optical Beam Induced Current (OBIC)
- Data Acquisition Considerations
- Backside Sample Preparation Considerations
Included with this lecture, you will receive 59 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 6
"IC Packaging Technology & Analytical Methods
Presenter: Tom Moore
Omniprobe, Inc.
Lecture 6 focuses on device packaging FA. Tom explains in detail problems associated with device packages and methods of detection.
Topics:
- Package Characterization and Fault Isolation
- Critical package defects
- Advanced package characterization techniques
- Scanning Acoustic Microscopy (SAM)
- Real-time X-ray Radiography (RTX)
- Time Domain Reflectometry (TDR)
- Looking for gaps in the package characterization roadmap
Included with this lecture, you will receive 41 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 3
Lecture 7
"Decapsulation and Package Analysis"
Presenter: Mike Strizich
ASI
In Lecture 7 Mike discusses current packing technology, and the process of performing FA to discover various failure modes.
Topics:
- Package Analysis Techniques
- Orderly Steps
- Non-Destructive vs.Destructive
- Typical Package Failure Modes
- Decapsulation Techniques
- Plastic Packages
- Cavity type Packages
Included with this lecture, you will receive 49 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 8
"Fault Isolation Optical Techniques"
Presenter: Ed Cole
Sandia Labs
Lecture 8 provides an opportunity for Ed to continue his discussion from Lecture 5 regarding optical techniques of FA using lasers.
Topics:
- Laser Beam Approaches & Techniques
- Imaging Confocal
- Imaging Backside
- Photocurrent Generation (OBIC, LIVA)
- LIVA Completed and Thermal Approaches
- SEI and TIVA
Included with this lecture, you will receive 34 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 9
"Atomic Force Microscopy"
Presenter: Pai Tangyunyong
Sandia Labs
In lecture 9 Pai explains Scan Probe Microscopy (SPM) and Scanning Force Microscopy (SFM).
Topics:
- What is SPM
- Common Features - SPM
- Image Acquisition - SPM
- Scanning Force Microscopy (SFM) or AFM
- Contact, Tapping, and Non-Contact
- Scanning Capacitance Microscopy
Included with this lecture, you will receive 46 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 4
Lecture 10
"Deprocessing and Sample Preparation"
Presenter: Mike Strizich
ASI
Lecture 10 explains how chemical deprocessing, mechanical lapping and cross sectioning techniques have become extremely important to the failure analyst. Shrinking geometry sizes and introduction of new materials make this even more challenging.
Topics:
- Basic Chemistry
- Passivation Removal
- Plasma Etching And Rie Etching
- Metal Etches (Al vs. Cu)
- Polysilicon Etches
- Silicon Etches
- Parallel Lapping
- Cross Section Stains
- Backside Etching
- GaAs Etches
Included with this lecture, you will receive 47 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 11
"Soft Defect Localization"
Presenter: Ed Cole
Sandia Labs
Lecture 11 - Ed describes laser scanning microscopy methods used to isolate soft defects. This is usually referred to as Soft Defect Localization or SDL. SDL is a technique that quickly and easily locates soft defects on complex ICs and is applicable from the front and backside of an IC.
Topics:
- Discussion of Soft Defects
- Physics of SDL
- SDL Imaging System
- SDL Imaging Results
- Many interesting pictures are explained
Included with this lecture, you will receive 31 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 12
"Advanced Fault Isolation - Thermal Imaging"
Presenter: Dan Barton
Sandia Labs
Lecture 12 - it's all about Thermal Imaging. Dan introduces the concepts of locating Blackbody Radiation (hot spots) within integrated circuits using techniques such as IR Thermography, Liquid Crystal Detection and Fluorescent Microthermal Imaging.
Topics:
- Liquid Crystal Thermography (LC)
- Fluorescent Microthermal Imaging (FMI)
- Infrared Thermography (IRT)
- Optical Interferometry
- Thermoreflectance Laser Probing
- Photothermal Deflection Spectroscopy (PDS)
- Internal Infrared Laser Deflection
- STM - Thermocouple Probe
- ISFM - Resistive Probe Tip
Included with this lecture, you will receive 87 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 5
Lecture 13
"Issues of Backside Sample Prep"
Presenter: Dan Barton
Sandia Labs
Topics:
- Light transmission through silicon
- Optical image formation through silicon
- Backside preparation techniques
- Global Si thinning
- Local Si thinning/Precision probe hole milling
- Backside FA techniques
- Passive (emission-based) techniques
- Active techniques
Included with this lecture, you will receive 108 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 14
"Backside Analysis Techniques"
Presenter: Mike Bruce
AMD
Lecture 14 is extremely informative! Mike begins the discussion of Backside Failure Analysis using commercially available techniques, then follows up with a smattering of “not quite ready for primetime” techniques. This information is based on a review written for Electron Device Failure Analysis Magazine, published November 2003. Co-Authors were Victoria Bruce, Seth Prejean, and Jeffery Huynh.
Topics:
- Backside Optical Microscopy
- Backside Photon Emission Microscopy
- Static and Time Resolved (PICA)
- Laser Based Fault Isolation
- LIVA, TIVA, OBIRCH, SEI, SCOBIC, SDL, LVP
- Backside Sample Preparation
- Parallel Polishing, Milling, Laser Chemical Etching
- Backside Deprocessing
- Backside FIB (Focused Ion Beam)
Included with this lecture, you will receive 35 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 15
"Photoemission Techniques"
Presenter: Dan Barton
Sandia Labs
Lecture 15 - Dan explains the finer points of photoemission in this lecture and supports his discussion with plenty of math and graphs. No details are left unexplained. It is best to watch this one first thing in the morning, while your brain is still fresh!
Topics:
- Light emission theory
- Light Emission Microscopy / Pros and Cons
- Spectral analysis
- Light emission systems
- Backside analysis
Included with this lecture, you will receive 66 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 6
Lecture 16
"Electronics of Failure I"
Presenter: Chuck Hawkins
UNM
In lecture 16 Professor Hawkins defines "Reliability". He compares electronic reliability of various technologies such as vacuum tubes vs. ICs, and gives examples of companies that have gone out of business due to product reliability issues. This leads to a detailed discussion of the following topics.
Topics:
- Models, Data, and the Bathtub Curve
- Point Defects
- Electromigration
- Stress Voiding
- Test Basics: Function, Fault, Defect-Based Testing
- Speed Testing
- Stuck-at Fault Model
- IDDQ Testing
- Design for Test (DFT)
- System on a Chip (SOC)
Included with this lecture, you will receive 45 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 17
"Electronics of Failure II"
Presenter: Chuck Hawkins
UNM
Lecture 17 - Chuck continues his discussion focusing on defect detection using a strategy known as "Defect-Based-Testing". This involves understanding the type of defects that are likely to occur, and developing tests that target the change in circuit behavior caused by the defect. This test approach is much different than simply verifying that the circuit is functional and meeting its data-book parameters.
Topics:
- Electronic Properties of Defects
- Defect Based Testing
- Low VDD Failure Mechanisms
- Functionality and Setup and Hold Times
- Bridge & Open Defects
- Parametric Failures
- Defect-Based Test Analysis
Included with this lecture, you will receive 40 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
Lecture 18
"Optoelectronic Device FA"
Presenter: Dan Barton
Sandia Labs
In lecture 18Dan explains LASER basics and provides a wealth of pictures illustrating various failure modes of optoelectronics.
Topics:
- Opto materials, devices and defects introduction
- Advanced sample preparation methods
- How FIBs make our lives easier
- Classic FA tools
- Photoluminescence
- Cathodoluminescence
- Electroluminescence
- EBIC / TEM
- Plan view vs. cross section TEM analysis
- Advanced FA tools
- TIVA and its application to Opto FA
Included with this lecture, you will receive 63 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Click here for a sample video of the presentation. The size and quality of the video have been reduced for playing on the web.
DVD 7
Lecture 19
"EOS / ESD"
Presenter: Chuck Hawkins
UNM
Professor Hawkins in back again in lecture 19, this time he discusses Electrical OverStress and Elector Static Discharge. Chuck explains EOS/ESD: what they are and how to tell the difference.
Topics:
- Electrical Over Stress / Electro Static Discharge
- EOS / ESD Damage
- ESD Awareness
- Damage Mechanisms
- Triboelectric Series
- ESD Models
- HBM / FICDM Test Methods
- Failure Analysis - Is It EOS or ESD
- ESD Protection Circuitry
- Prevention
Included with this lecture, you will receive 29 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 20
"Advanced Fault Isolation 1: SQUID Microscopy"
Presenter: Lee Knaus
Neocera Corp.
Lecture 20 - Lee has worked on development of the Advanced Fault Isolation Microscopy system called the Superconducting Quantum Interference Device (SQUID). Lee explains why this technology is needed and the type of defects that can be localized by its use.
Topics:
- Magnetic Field Imaging
- Paradigm Shift in IC Packaging
- How SQUID works
- Block Diagram of a SQUID Microscope
- SQUID - Sample Separation
- Example Applications
- Multichip Module Imaging
- Processor Magnetic / Current Image overlays
Included with this lecture, you will receive 28 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 21
"Advanced Fault Isolation 2: SQUID Microscopy"
Presenter: Lee Knaus
Neocera Corp.
Lecture 21 is the second half of Lee's lecture on the SQUID Microscope. Lee continues to explain how the instrument is used for current imaging and its use for failure analysis in semiconductor applications.
Topics:
- Localizing Short Circuits with MAGMA-C1
- Current Image Overlay Backside
- Current Image Overlay Frontside
- Defect Location
- Test Subject
- Background & Current Magnetic Fields
- Technique Comparison
- Scanning SQUID Capability Limits
- and more...
Included with this lecture, you will receive 44 presentation slides in PDF format. Lecture time is approximately 75 minutes.
DVD 8
Lecture 22
"Focused Ion Beam (FIB) methods"
Presenter: Joe Michael
Sandia Labs
In lecture 22 Joe explains the workings of Focused Ion Beam instrumentation. It's obvious that Joe has years of experience in this area and he supports his discussion with excellent pictures and graphs.
Topics:
- Typical FIB Configurations
- Theory of Liquid Metal Ion Source (LMIS)
- Gas Injection Systems
- Ion - solid Interaction Monte Carlo Modeling
- FIB Micromachining
- Techniques for location of areas of interest
- Sulfide Corrosion Bloom
- Prethinned FIB Technique
- VCSEL Failure Analysis
Included with this lecture, you will receive 56 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 23
"MEMS Failure Analysis I"
Presenter:Jerry Walraven
Sandia Labs
Lecture 23 - Jerry explains the details of Microelectromechanical Systems (MEMS) technology. He discusses tools and techniques for MEMS failure analysis, and describes failure mechanisms observed in various MEMS technologies.
Topics:
- What are MEMS?
- MEMS Fabrication Technologies
- MEMS Application Technologies
- Future MEMS Applications
- Tools and techniques for MEMS FA
- MEMS failure mechanisms
- MEMS Polymer & MEMS Sensors
- Chemical detection systems
- Optical MEMS Actuators
- RF MEMS & Microfluidic MEMS
- Electrostatic Drop Ejection
- BioMEMS
Included with this lecture, you will receive 34 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 24
"MEMS Failure Analysis II"
Presenter:Jerry Walraven
Sandia Labs
In Lecture 24 Jerry explains that MEMS Failure Analysis activities fall into 3 separate categories: Structural, Chemical and Electrical.
Topics:
- Structural analysis: Optical Microscopy
- Infrared (IR) thermal imaging
- Device repair using the FIB
- Scanning electron microscopy
- Atomic force microscopy
- Transmission Electron Microscopy (TEM)
- MEMS FA using Auger Spectroscopy
- Voltage contrast imaging
- Resistive contrast imaging (RCI)
- Stiction
- And much more with great photos
Included with this lecture, you will receive 42 presentation slides in PDF format. Lecture time is approximately 75 minutes.
DVD 9
Lecture 25
"Failure Analysis in High Volume Manufacturing"
Presenter: Kathy Clark
Lecture 25 - Kathy shares the experience gained working as a senior engineer at Intel in Yield Engineering and Failure Analysis. Her lecture focuses on FAs contribution in a High Volume Manufacturing (HVM) Fab environment.
Topics:
- Factory indicators
- Role of FA engineer
- Types of yield problems: Parametric, Systematic, Random
- Yield Engineering Examples
- Typical HVM FA Lab
- Failure Analysis Flow Chart
- Typical failure analysis plan
Included with this lecture, you will receive 32 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 26
"Integrated Circuit Debug and Validation"
Presenter: Professor Lawrence Clark
UNM
In Lecture 26 Professor Clark describes integrated circuit debug, validation, and characterization including Methodologies, Tools and some interesting anecdotal experiences.
Topics:
- Debug - Methods and Tools
- Pre/Post- Silicon Logic Validation
- Methodologies - Planning for Problems
- Methodologies - Navigation
- Tools: Tester - Shmoo Plots / IV Measurements
- Infra-red Emission Microscopy (IREM)
- SEM Contrasting
- Laser Voltage Probe (LVP)
- Time Resolved Emission (TRE)
- Testing Fixes
- Focused Ion Beam (FIB)
- Experiences - Debug can be FUN!
Included with this lecture, you will receive 32 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 27
"Elemental Analysis for FA"
Presenter: Paul Kotula
Sandia Labs
Lecture 27 - Paul begins by addressing the motivation behind elemental analyses and explains various types of chemical analysis. He then moves onto the details of various types of spectroscopy. This lecture is very well presented and supported with a variety of excellent photographs.
Topics:
- X-ray spectroscopy
- X-rays (SEM-EDXS, STEM-EDXS, XRF)
- Electron spectroscopy
- Auger electron spectroscopy (AES)
- X-ray photoelectron spectroscopy (XPS)
- Energy-loss electrons (STEM-EELS)
- Mass spectroscopy (SIMS, TOF-SIMS)
- FA example analyses and State-of-the-art techniques
Included with this lecture, you will receive 57 presentation slides in PDF format. Lecture time is approximately 75 minutes.
DVD 10
Lecture 28
"Focus on Structural Test: AC Scan"
Presenter: Alfred Crouch
Inovys Corp.
Al Crouch is a leader in DFT, and is a master at making the complex sound simple. In lecture 28 Al explains how Design for Test (DFT) technology is used to provide information useful for identifying and locating defects, that can then be investigated through FA.
Topics:
- What's Driving Modern Test Technology?
- IP Reuse / SoC Integration Problem
- Predominant Failure Mode
- Structural Test and DFT/EDA
- Types of Structural Test
- Structural Deterministic Test
- What is AC Scan?
- All about Signal Paths
- Automating Path-Based ATPG
- AC Scan for Physical Debug
Included with this lecture, you will receive 110 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 29
"Failure Analysis Lab Management"
Presenter: Dick Ross
IBM
Lecture 29 is somewhat different from the other lectures. Until now most of the lecture material has focused on engineering/science, Dick's lecture is people/management oriented. This is an excellent presentation explaining what it takes to put together and manage a first rate Failure Analysis Lab. Dick's years of experience provides the necessary background for this topic.
Topics:
- Staffing
- Lab Organization
- Lab Design
- Lab Operations
- Development
- Financial Mgmt
- Metrics
- Summary
Included with this lecture, you will receive 89 presentation slides in PDF format. Lecture time is approximately 75 minutes.
Lecture 30
"Course Summary"
Presenter: Chuck Hawkins
UNM
Lecture 30 - Professor Hawkins presents a summary to the Microelectronics Failure Analysis Lecture Series.
There are no presentation slides associated with this lecture. Lecture time is approximately 75 minutes.
