Technology

Semiconductor Technology encompasses the fundamental device groups and the methods used to create these technologies. This encompasses Logic Devices (Digital), Analog Devices, Mixed Signal Devices (Analog and Digital on the same chip), Memory Devices, High Voltage Devices, High Frequency Devices, Optoelectronics, and Micro Electro Mechanical Systems (MEMS). There are a number of key processes that enable these devices that include CMOS (Complimentary Metal Oxide Semiconductor), Bipolar, MESFET (Metal Electrode Semiconductor Field Effect Transistors, and a wide range of lesser processes.

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Introduction

Presentations

Basic CMOS Process Animation

Documents

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Interconnect Technology

Today's ICs may contain kilometers of interconnect and billions of vias, so the interconnect system must be manufactured with the utmost precision. This course covers issues associated with interconnect on semiconductor devices. It covers both aluminum and copper interconnect systems.

Presentations

Interconnect Scaling Overview

Documents

Interconnect Scaling

Videos

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Memory Technology

This material covers the technology of memory ICs. Memory is ubiquitous in today's electronic systems. There are several types of memory: dynamic random access memory (DRAM), static random access memory (SRAM), and non-volatile memory (NVM). Each has its advantages and disadvantages, and each has different design and manufacturing techniques.

Presentations

Memory Technology Overview

DRAM Introduction and Scaling

DRAM Technology

Atom Switch Technology

Fusible Link Technology

Quartz Disc Storage Systems

Documents

Memory Technology

Fusible Link Technology

DRAM Introduction and Scaling

DRAM Cell and Capacitor

DRAM Scaling Challenges

Quartz Disc Storage Systems

Atom Switch Technology

Videos

Energy Band Transitions

PN Junction Diodes

SOI Technology

Silicon on Insulator Technology is an important technology for addressing difficult problems within the semiconductor industry. Silicon on Insulator, or SOI, is the process of building semiconductor devices on a thin insulating layer, or on a sapphire (aluminum oxide) substrate. The common technique today is to create a very thin insulating layer. SOI Technology is used for creating devices that are immune to CMOS latchup. It is also used to create low power circuits. These presentations describe SOI Technology in more detail.

Presentations

Silicon On Insulator Overview

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Compound Semiconductor Technology

Compound Semiconductors are used increasingly in today's electronics. Cellular phones, power amplifiers, lasers, and even switching transistors for hybrid electric vehicles utilize compound semiconductor devices. In the near future, we are also likely to use compound semiconductor materials in CMOS transistors. This section provides presentations and material on Gallium Arsenide (GaAs), Gallium Nitride (GaN), and Silicon Carbide (SiC).

Presentations

Silicon Carbide Failure Mechanisms

Gallium Nitride Failure Mechanisms

Gallium Arsenide Failure Mechanisms

Compound Semiconductor Materials

HBT Basics

Documents

HBT Basics

Videos

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Power Device Technology

This material covers topics related to Power Transistors and Power Integrated Circuits. Power devices typically operate at voltages above 5 volts and current values in excess of 100mA. This is a growing area for device development, and there are numerous types of devices and technologies. These devices are common in power converters, inverters, chargers, regulators, and other high voltage circuits.

Presentations

Smart Power Devices - Fundamentals

Smart Power Devices - Issues

Smart Power Devices - Integration Options

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