Failure Analysis - Materials Characterization

Materials characterization is an important discipline within the semiconductor manufacturing field. One must be able to identify and characterize topography, vertical structures, aspect ratios, concentrations, dopant distributions, as well as defective conditions and foreign material. Materials characterization can loosely be divided into two groups: imaging techniques and materials analysis techniques.

Materials Characterization is occasionally used in failure analysis, and extensively used in yield analysis activities. There are a wide variety of techniques that allow examination of the device surface, as well as the top few microns of a sample. These include techniques like Auger Electron Spectroscopy, which is used for surface analysis, energy dispersive x-ray spectroscopy, which is used for analysis of the top 1 to 5 microns of a sample, Secondary Ion Mass Spectroscopy can be used for both surface analysis and depth profiling, and Transmission Electron Microscopy is used for high resolution imaging of prepared samples.

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Presentations

Analytical Techniques - Basic

Analytical Techniques - Advanced

Analytical Techniques - Imaging

Surface Photovoltage Technique

Secondary Ion Mass Spectroscopy

Time-Of-Flight Secondary Ion Mass Spectroscopy

Electron Energy Loss Spectroscopy

Auger Electron Spectroscopy

Electron Backscatter Diffraction

Transmission Electron Microscopy

Energy-Dispersive X-Ray Spectroscopy

Quiz: Analytical Techniques

Documents

Analytical Techniques - Basic

Analytical Techniques - Advanced

Analytical Techniques

ATPG Basics

Auger Electron Spectroscopy

Time-Of-Flight Secondary Ion Mass Spectroscopy

Electron Backscatter Diffraction

Energy-Dispersive X-Ray Spectroscopy

Videos

TEM - Electron Beam Diffraction

TEM - Energy Dispersive X-Ray Spectroscopy

TEM - Imaging

TEM - Sample Preparation

Energy Dispersive X-Ray Spectroscopy