System Maintenance occurs every Friday.
System Maintenance occurs every Friday.
This course covers solder joints and the analysis of problems that pertain to them. We primarily focus on the solder joints between the component and the board, rather than solder joints internal to a component, but many of the concepts will apply to both. We cover solder joint basics, quality analysis techniques, processing problems and troubleshooting techniques, contamination and cleanliness, and reliability testing methods.
$700
Please email the printable registration form for online training to us at the email address on the form to complete your order.
This section covers the fundamentals of solder joints. We discuss the basic physical process that occurs when one creates a solder joint, including the formation of the intermetallic layer that serves as the interface. We discuss the various fluxes and underfills that engineers use in conjuction with solder joints. We also discuss the various major mechanisms associated with solder joint failure.
Solder Joint Basics
Solder Joints - Materials and Processing
Solder Joint Fluxes and Underfills
Solder Joint Failure Mechanisms
Quiz: Solder Joints Basics
Solder Joint Failure Mechanisms
Solder Joint Basics
NONE
This section covers a variety of quality analysis techniques used to assess solder joints. This section is broken down into four groups: optical and scanning electron microscope inspection techniques, non-destructive analysis techniques like x-ray radiography, contamination analysis techniques, and structural analysis techniques like shear testing.
Optical and SEM Analysis Techniques
Non Destructive Analysis Techniques
Structural Analysis Techniques
Contamination Analysis Techniques
Quiz: Quality Analysis Techniques
Optical and SEM Analysis Techniques
NONE
This section covers the major processing problems as well as the techniques used to troubleshoot those problems. This includes solder wetting problems like head-in-pillow, voiding, pad cratering, and others. This section also includes cracking problems like creep and fatigue.
Cracking and Warpage Problems
Solder Wetting Problems and Troubleshooting Techniques
Quiz: Processing Problems and Troubleshooting Techniques
NONE
NONE
This section covers the topic of contamination and cleanliness. We discuss the main contamination types: the conductive anodic filament, creep corrosion, and dendritic growth. We discuss sources of contamination, like flux residues such as weak organic acids, and the environment, We also discuss techniques to identify contamination levels like ion chromotography, the Foresite C3 system, and the Omegameter.
Contamination and Cleanliness
Electrochemical Migration Primer
ECM Testing and Examples
Introduction to Cleanliness
Quiz: Contamination and Cleanliness
Contamination and Cleanliness
NONE
This section covers the topic of reliability testing. These tests are accelerated tests to create failures quickly to allow the engineer to assess the overall reliability of the solder joint and develop failure models. We discuss solder joint stress tests such as temperature cycling, the bend test, the drop test, vibration testing, humidity testing, and more.
Board Level Reliability
Quiz: Solder Joint Reliability Testing
Board Level Reliability
NONE