Semiconductor Reliability and Product Qualification (Online Version)

Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, the proliferation of new package types, etc. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. While customers expect high reliability levels, incorrect assumptions, testing, calculations, and qualification procedures can severely impact reliability. Your company needs competent engineers and scientists to help solve these problems. Semiconductor Reliability and Product Qualification is an online course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and qualification. This course is designed for every manager, engineer, and technician concerned with reliability in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.

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Interested in a version of this course where you can ask questions in real time? Public and In-House versions of this course are available!

What Will I Learn By Taking This Class?

Registrants learn to develop the skills to determine what failure mechanisms might occur, and how to test for them, develop models for them, and eliminate them from the product.

  1. Overview of Reliability and Statistics. Registrants learn the fundamentals of statistics, sample sizes, distributions and their parameters.
  2. Failure Mechanisms. Registrants learn the nature and manifestation of a variety of failure mechanisms that can occur both at the die and at the package level. These include: time-dependent dielectric breakdown, hot carrier degradation, electromigration, stress-induced voiding, moisture, corrosion, contamination, thermomechanical effects, interfacial fatigue, etc.
  3. Qualification Principles. Registrants learn how test structures can be designed to help test for a particular failure mechanism.
  4. Test Strategies. Registrants learn about the JEDEC test standards, how to design screening tests, and how to perform burn-in testing effectively.

Course Objectives

  1. This course will provide registrants with an in-depth understanding of the failure mechanisms, test structures, equipment, and testing methods used to achieve today’s high reliability components.
  2. Registrants will be able to gather data, determine how best to plot the data and make inferences from that data.
  3. This course will identify the major failure mechanisms, explain how they are observed, how they are modeled, and how they are eliminated.
  4. This course offers a variety of exercises, so the participants can get an understanding of the types of results they might expect to see with their products.
  5. Registrants will be able to identify the steps and create a basic qualification process for semiconductor devices.
  6. Registrants will be able to knowledgeably implement screens that are appropriate to assure the reliability of a component.
  7. Registrants will be able to identify appropriate tools to purchase when starting or expanding a laboratory.

Course Outline

Reliability Fundamentals


  1. Introduction to Semiconductor Reliability
  2. Acceleration and Number of Failures
  3. Plotting Data
  4. Reliability Distribution Types
  5. Basic Reliability Statistics
  6. Reliability Statistics - Acceleration
  7. Reliability Statistics - Sample Size
  8. Which Distribution Should I Use?


  1. Reliability Distributions
  2. Reliability Distribution Examples

Die and Package Failure Mechanisms


  1. Time Dependent Dielectric Breakdown Overview
  2. Hot Carrier Degradation - Overview
  3. Electromigration
  4. Stress Induced Voiding - Case History
  5. Stress Induced Voiding
  6. Ionic Contamination
  7. Moisture and Corrosion
  8. Thermomechanical Stress - Part 1
  9. Thermomechanical Stress - Part 2
  10. Thermal Degradation


  1. Electromigration
  2. Stress Induced Voiding - Introduction

Chip Attach and System Reliability


  1. Solder Joint Failure Mechanisms
  2. Reliability Testing
  3. Through Silicon Vias
  4. Electrical Overstress and ESD
  5. Radiation Effects

Qualification Testing


  1. Test Structures - Basics
  2. Reliability Test Structures
  3. Self Stressing Test Structures
  4. Reliability Test Equipment - Wafer Level
  5. Reliability Test Equipment - Probes
  6. Reliability Test Equipment - Packaged Parts
  7. Developing Electrical Screens
  8. Developing Stress Tests and Life Tests
  9. Product Qualification Overview
  10. MIL STD Qualification
  11. Failure Mechanism Driven Qualification
  12. Stress Driven Qualification
  13. AEC Q100 Qualification
  14. Knowledge Based Qualification


  1. Bond Shear
  2. Wire Pull Test