System Maintenance occurs every Friday.
Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact of new materials; dealing with limited margins, and other factors. In particular, the proliferation of new package types can create difficulties. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. Customers expect fast, smooth qualification, but incorrect assumptions, use conditions, testing, calculations, and qualification procedures can severely impact this process. Your company needs competent engineers and scientists to help solve these problems. Product Qualification Overview is a 1-day course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and product qualification. This course is designed for every manager, engineer, and technician concerned with qualification in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.
February 5, 2025 | Phoenix, AZ
(Price available until Wed. Jan. 15)
$695
$595
Please note: If you or your company plan to pay by wire transfer, you will be charged a wire transfer fee of USD 45.00.
Please email the printable registration form for public courses to us at the email address on the form to complete your order.
If you have any questions concerning this course, please contact us at info@semitracks.com.
If a course is canceled, refunds are limited to course registration fees. Registration within 21 days of the course is subject to $100 surcharge.
Participants will learn to develop the skills to determine the best process for qualification; how to identify issues; and how to resolve them. This skill-building series is divided into four segments: