Semiconductor reliability is at a crossroads. In the past, reliability meant discovering, characterizing, and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. The product lifecycle for many components has become so short that there are limited opportunities to impact the overall reliability of the device, whether that be testing at the package level or even the wafer level. While reliability levels are at an all-time high level in the industry, design changes and tradeoffs may cause the chip reliability to quickly deteriorate. Thus, engineers have to put thought and effort into the reliability of a component during the design phase.
How can you do this properly? Your company needs competent engineers and scientists to help solve these problems. Semitracks' 3-day Design for Reliability course offers detailed instruction on a variety of subjects pertaining to designing in reliability.
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Please fax the printable registration form for public courses to us at 1-866-205-0713 to complete your order.
The course is divided into three segments:
The course is designed for every manager, engineer, and technician concerned with reliability in the semiconductor field, designing semiconductor components, or supplying tools to the industry.
Our courses are dynamic. We use a combination of instruction by lecture, problem solving, and question/answer sessions to give you the tools you need to excel in semiconductor reliability design. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. The course notes offer hundreds of pages of reference material that the participants can apply during their daily activities.
Our instructors are internationally recognized experts. Our instructors have years of current and relevant experience in their fields. They're focused on answering your questions and teaching you what you need to know.
Dr. Joe McPherson received his Ph.D. in Physics from Florida State University. Prior to joining Texas Instruments, he was an assistant professor with the University of North Carolina and a visiting scientist with the Argonne National Laboratory. He joined TI in 1980 as a process development engineer and was instrumental in bringing silicides and laser redundancy into IC production. Since 1983, he has primarily focused on reliability physics, where he has received numerous Best/Outstanding Paper Awards, published over 200 articles on semiconductor reliability, authored the reliability chapters for four books, and holds 12 patents. He was the 1995 general chairman of the IEEE International Reliability Physics Symposium (IRPS) and still serves on its board of directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was chairman of the Sematech Reliability Council. Joe is Texas Instruments' Senior Fellow Emeritus and an IEEE Fellow.