Education and Training for the Electronics Industry
Semitracks provides education, training, and certification services and products for the electronics industry. We specialize in serving Semiconductor, Microsystems and Nanotechnology suppliers and users. Semitracks, Inc. helps engineers, technicians, scientists, and management understand these dynamic fields. We offer courses in Semiconductor Reliability, Test, Packaging, Process Integration, Failure and Yield Analysis, and Focused Ion Beam technology. Learn from the Experts.
Solder balls can be formed in one of two ways – stamp and reflow or solder jetting. The stamp and reflow process starts with either solder wire, or a sheet of solder material. The solder wire is cut into small cylinders, which are then subjected to an elevated temperature to reflow them into solder spheres. The sheets are stamped into small cylinders and reflowed to create solder spheres. The reflow operation is accomplished by dropping the cylinders into a liquid thermal transfer medium that is stable at the liquidus temperature of the solder alloy. The medium is also a material that is inert to the solder itself, such as Fluorinert. Once in the medium, the cylinders will liquify and form spheres. This occurs because the solder attempts to minimize the free surface area. The spheres can then be collected, and the liquid medium residue can be removed using a solvent such as acetone. The second method is solder jetting. In the solder jetting process, solder is melted into a liquid in an inert environment such as argon or nitrogen. Elevated pressure on the inert gas forces the liquid solder through a small orifice. This action, coupled with a periodic impulse and a small amount of oxygen, breaks the stream into small droplets. The size of the droplets can be controlled by the overpressure and the size of the orifice. The spheres are then cooled in an inert environment and are collected for use.
We have continued to expand our online training materials over the past year. We have added a significant amount of new material in the reliability section, as well as new material in a number of the other sections. Our material contains flash-based courses, quizzes, and interactive exercises, as well as PDF materials for off-line reading.
Call us at 1-505-858-0454, or e-mail us at email@example.com for a free trial account.
Semitracks makes some of its materials available for free on our website. At this time, the reference material contains some basic information on some design and failure analysis topics.
To access this material, please visit http://www.semitracks.com/reference-material/.
Semitracks continues to expand its course offerings this year with new courses and new locations. We are also offering several courses in India for the first time this spring. For more information on these courses, and our courses in North America and Europe, click on the links below.
Wafer Fab Processing on June 23-26, 2008 in Kuala Lumpur, Malaysia and Singapore
Advanced Thermal Management on July 16-18, 2008 in Kuala Lumpur, Malaysia
Packaging Technology on August 3-4, 2008 in Tel Aviv, Israel
ESD Design and Technology on August 3-4, 2008 in Tel Aviv, Israel
RF & Mixed Signal Testing on August 4-7, 2008 in Penang, Malaysia
Packaging Design on August 5-7, 2008 in Tel Aviv, Israel
Failure and Yield Analysis on August 5-7, 2008 in Tel Aviv, Israel
Semiconductor Reliability on August 19-22, 2008 in Kuala Lumpur, Malaysia
If you have a suggestion or a comment regarding our courses, online training, discussion forums, reference materials, or if you wish to suggest a new course or location, please feel free to call us at 1-505-858-0454, or e-mail us at firstname.lastname@example.org.
Home > Newsletters > 2008 May Newsletter