A modern semiconductor manufacturing process is one of the most difficult and complex processes to successfully control. There are thousands of variables that must all be tightly controlled in order to have a chance at repeatedly manufacturing a chip within a tight tolerance so that it can be successfully used in an electronics system. Furthermore, a modern semiconductor manufacturing process generates an incredible volume of data. This requires that engineers be able to not only choose the right data to examine, but also examine it in such a way as to understand the behavior of the process. We do this through statistical process control. This course is designed specifically for engineers who work in semiconductor manufacturing operations. We provide numerous real-world examples from semiconductor operations such as wafer fabrication, assembly, test, and reliability.
February 7-8, 2017 | Portland, OR, USA
May 22-23, 2017 | Munich, Germany
(Price available until Mon. May 1)
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Please fax the printable registration form for public courses to us at 1-866-205-0713 to complete your order.
By focusing on tried and true methods for SPC, participants will learn the appropriate methodology to successfully identify problems, characterize them, and determine the root cause of failure.
Participants learn to develop the skills to determine what tools and techniques should be applied, and when they should be applied. This skill-building series is divided into four segments:
By using a combination of instruction by lecture, video, problem solving and question/answer sessions, participants will learn practical approaches to the failure analysis process. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. We use instructors who are internationally recognized experts in their fields that have years of experience (both current and relevant) in this field. The handbook offers hundreds of pages of additional reference material the participants can use back at their daily activities.
Christopher Henderson received his B.S. in Physics from the New Mexico Institute of Mining and Technology and his M.S.E.E. from the University of New Mexico. Chris is the President and one of the founders of Semitracks Inc., a United States-based company that provides education and semiconductor training to the electronics industry.
From 1988 to 2004, Chris worked at Sandia National Laboratories, where he was a Principal Member of Technical Staff in the Failure Analysis Department and Microsystems Partnerships Department. His job responsibilities have included failure and yield analysis of components fabricated at Sandia's Microelectronics Development Laboratory, research into the electrical behavior of defects, and consulting on microelectronics issues for the DoD. He has published over 20 papers at various conferences in semiconductor processing, reliability, failure analysis, and test. He has received two R&D 100 awards and two best paper awards. Prior to working at Sandia, Chris worked for Honeywell, BF Goodrich Aerospace, and Intel. Chris is a member of IEEE and EDFAS (the Electron Device Failure Analysis Society).
At Semitracks, Chris teaches courses on failure and yield analysis, semiconductor reliability, and other aspects of semiconductor technology.