Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability, assessing the impact of new materials, dealing with limited margins, etc. in particular, the proliferation of new package types. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. While customers expect high reliability levels, incorrect testing, calculations, and qualification procedures can severely impact reliability. Your company needs competent engineers and scientists to help solve these problems. Semiconductor Reliability and Qualification is a 4-day course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and qualification. This course is designed for every manager, engineer, and technician concerned with reliability in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.
May 15-18, 2017 | Munich, Germany
(Price available until Mon. Apr. 24)
Please fax the printable registration form for public courses to us at 1-866-205-0713 to complete your order.
Participants learn to develop the skills to determine what failure mechanisms might occur, and how to test for them, develop models for them, and eliminate them from the product.
By using a combination of instruction by lecture, video, problem solving and question/answer sessions, participants will learn practical approaches to the failure analysis process. From the very first moments of the seminar until the last sentence of the training, the driving instructional factor is application. We use instructors who are internationally recognized experts in their fields that have years of experience (both current and relevant) in this field. The handbook offers hundreds of pages of additional reference material the participants can use back at their daily activities.
One unique feature of this workshop is the video segments used to help train the students. Reliability Analysis is a visual discipline. The ability to identify nuances and subtleties in graphical data is critical to locating and understanding the defect. Some tools output video images that must be interpreted by engineers and scientists. No other course of this type uses this medium to help train the participants. These videos allow the analysts to directly compare material they learn in this course with real analysis work they do in their daily activities.
Christopher Henderson received his B.S. in Physics from the New Mexico Institute of Mining and Technology and his M.S.E.E. from the University of New Mexico. Chris is the President and one of the founders of Semitracks Inc., a United States-based company that provides education and semiconductor training to the electronics industry.
From 1988 to 2004, Chris worked at Sandia National Laboratories, where he was a Principal Member of Technical Staff in the Failure Analysis Department and Microsystems Partnerships Department. His job responsibilities have included failure and yield analysis of components fabricated at Sandia's Microelectronics Development Laboratory, research into the electrical behavior of defects, and consulting on microelectronics issues for the DoD. He has published over 20 papers at various conferences in semiconductor processing, reliability, failure analysis, and test. He has received two R&D 100 awards and two best paper awards. Prior to working at Sandia, Chris worked for Honeywell, BF Goodrich Aerospace, and Intel. Chris is a member of IEEE and EDFAS (the Electron Device Failure Analysis Society).
At Semitracks, Chris teaches courses on failure and yield analysis, semiconductor reliability, and other aspects of semiconductor technology.